Elastic membrane for semiconductor wafer polishing apparatus



FIG. 1 is a top perspective view a first embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a side view thereof, with the apparatus being radially symmetrical about a vertical axis;

FIG. 6 is a cross sectional view taken along section line 6-6 in FIG. 3;

FIG. 7 is an enlarged portion view taken along line 7-7 in FIG. 6;

FIG. 8 is a top perspective view a second embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 9 is a bottom perspective view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a side view thereof, with the apparatus being radially symmetrical about a vertical axis;

FIG. 13 is a cross sectional view taken along section line 13-13 in FIG. 10;

FIG. 14 is an enlarged portion view taken along line 14-14 in FIG. 13;

FIG. 15 is a top perspective view a third embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 16 is a bottom perspective view thereof;

FIG. 17 is a top plan view thereof;

FIG. 18 is a bottom plan view thereof;

FIG. 19 is a side view thereof, the apparatus being radially symmetrical about a vertical axis;

FIG. 20 is a cross sectional view taken along section line 20-20 in FIG. 17;

FIG. 21 is an enlarged portion view taken along line 21-21 in FIG. 20;

FIG. 22 is a top perspective view a fourth embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 23 is a bottom perspective view thereof;

FIG. 24 is a top plan view thereof;

FIG. 25 is a bottom plan view thereof;

FIG. 26 is a side view thereof, the apparatus being radially symmetrical about a vertical axis;

FIG. 27 is a cross sectional view taken along line 27-27 in FIG. 24; and,

FIG. 28 is an enlarged portion view taken along line 28-28 in FIG. 27.

The broken lines shown in the drawings represent portions of the elastic membrane for semiconductor wafer polishing apparatus that form no part of the claimed design. 

CLAIM The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described. 